SPECIFICATIONS:
Weight
Main Board : 57g / 2.01 oz, Half-Height Bracket : 12g / 0.42 oz
Dimensions
Main Board: 117.4 x 121 x 21.6 mm / 4.62 x 4.76 x 0.85 inches, Half-Height Bracket: 80 x 21.6 mm / 3.15 x 0.85 inches
Audio Technology
SmartComms Kit
Signal-to-Noise Ratio (SNR)
120 dB (DAC)
Direct Mode
Headphone (Stereo): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Headphone (Stereo): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Line Out (Stereo / Surround): PCM 16-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Line Out (Stereo / Surround): PCM 24-bit, 44.1, 48.0, 88.2, 96.0. 192.0 kHz
Optical Out (Stereo)*: PCM 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
PCM 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
* Optical Out is available with DBPro daughter board upgrade
DSD Playback
Headphone/Line Out (Stereo): Native DSD: DSD64, DSD128, DSD256
DoP: DSD64
^ DSD Playback is available with DBPro daughter board upgrade
Recording Resolution
Mic-in (Mono): Mono, 16-bit, 44.1, 48.0, 88.2, 96.0 kHz
Mic-in (Mono): Mono, 24-bit, 44.1, 48.0, 88.2, 96.0 kHz
Line-in (Stereo): Stereo, 16-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
Line-in (Stereo): Stereo, 24-bit, 44.1, 48.0, 88.2, 96.0, 192.0 kHz
Connectivity Options (Main)
1 x ⅛″ Mic-in, 1 x ⅛″ Line-in, 1 x ⅛″ Headphone / Headset-out / Front-out (default as Headphone / Headset), 1 x ⅛″ Rear-out, 1 x ⅛″ Centre / Sub-out
Headphone Amp
Supported Headphone Impedance: 32–600Ω, Output Impedance: 10Ω
Max Channel Output
5.1 Channels
Supported Operating Systems
Windows® 10, Windows® 11
ASIO
ASIO 2.3
DAC
THD+N: ≤0.004%
Recommended Usage
Home Entertainment
System Requirements
Windows® OS
Intel® Core™i3 or AMD® equivalent processor
Intel, AMD, or 100% compatible motherboard
Microsoft® Windows 10 32 / 64-bit or higher
>4 GB RAM
>4 GB of free hard disk space
Available PCIe slot
Package Contents
Sound Blaster Audigy Fx V2 Sound Card
Half-height bracket (Full height bracket mounted on board)
Quick Start Leaflet
Warranty Leaflets
SmartComms Kit Leaflet